17.00 17.00 0.80 typ 15.20 15.20 top view a1 side view 2.560.25 0.36 2 1 3 proprietary and confidential - the information contained in this drawing is the sole property of ironwood electronics, inc. any reproduction in part or as a whole without the written permission of ironwood electronics, inc. is prohibited. u.s. patent no. 8,091,222 b2 item no. description 1 high temp substrate 2 high density giga-snap receptacle 3 solder ball, 0.4572mm dia (see table) part no. suffix solder ball alloy -64 sn63pb37 -64f* sn96.5ag3.0cu0.5 *rohs compliant ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: giga-snap bga smt foot primary dimension units are millimeters, secondary dimension units are [inches]. status: released rev. b date: 04/06/2012 material: n/a finish: n/a weight: n/a SF-BGA400H-B-64f drawing scale: 4:1 sheet: 1 of 2 drawn by: m. raske file: SF-BGA400H-B-64 SF-BGA400H-B-64 drawing
rev date initials description a - - original b 7/7/15 mt/oa updated materials to generic definitions ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: revision history primary dimension units are millimeters, secondary dimension units are [inches]. status: released rev. b date: 04/06/2012 material: finish: weight: specification scale: 1:1 sheet: 2 of 2 drawn by: m. raske file: SF-BGA400H-B-64
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